1 motorola smallsignal transistors, fets and diodes device data maximum ratings (t a = 25 c) rating symbol value unit collectorbase voltage v (br)cbo 60 vdc collectoremitter voltage v (br)ceo 50 vdc emitterbase voltage v (br)ebo 7.0 vdc collector current e continuous i c 100 madc collector current e peak i c(p) 200 madc thermal characteristics characteristic symbol max unit power dissipation p d 200 mw junction temperature t j 150 c storage temperature t stg 55 ~ +150 c electrical characteristics (t a = 25 c) characteristic symbol min max unit collectoremitter breakdown voltage (i c = 2.0 madc, i b = 0) v (br)ceo 50 e vdc collectorbase breakdown voltage (i c = 10 m adc, i e = 0) v (br)cbo 60 e vdc emitterbase breakdown voltage (i e = 10 m adc, i c = 0) v (br)ebo 7.0 e vdc collectorbase cutoff current (v cb = 45 vdc, i e = 0) i cbo e 0.1 m adc collectoremitter cutoff current (v ce = 10 vdc, i b = 0) i ceo e 100 nadc dc current gain (1) (v ce = 10 vdc, i c = 2.0 madc) msd601rt1 msd601st1 (v ce = 2.0 vdc, i c = 100 madc) h fe1 h fe2 210 290 90 340 460 e e collectoremitter saturation voltage (i c = 100 madc, i b = 10 madc) v ce(sat) e 0.5 vdc 1. pulse test: pulse width 300 m s, d.c. 2%. device marking marking symbol yr x msd601rt1 ys x msd601st1 the axo represents a smaller alpha digit date code. the date code indicates the actual month in which the part was manufactured. thermal clad is a trademark of the bergquist company preferred devices are motorola recommended choices for future use and best overall value. order this document by msd601rt1/d
semiconductor technical data ? motorola, inc. 1996 *motorola preferred device case 318d03, style 1 sc59 2 1 3 collector 3 2 base 1 emitter rev 2
2 motorola smallsignal transistors, fets and diodes device data minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be t h e c orrec t s iz e t o i nsur e p rope r s older c onnection interfac e b etwee n t he b oard a n d t h e p ackage . w it h t he correct p a d g eometry , t h e p ackage s w il l s el f a lig n w hen subjected to a solder reflow process. mm inches 2.53.0 0.039 1.0 0.094 0.8 0.0980.118 2.4 0.031 0.95 0.037 0.95 0.037 sc59 power dissipation the power dissipation of the sc59 is a function of the pad size. this can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. power dissipation f o r a s urfac e m oun t d evic e i s d etermined b y t j(max) , the maximum rated junction temperature of the die, r q ja , t h e t herma l r esistanc e f ro m t h e d evic e j unctio n t o ambient; a n d t h e o peratin g t emperature , t a . u sing t he values provided on the data sheet, p d can be calculated as follows: p d = t j(max) t a r q ja the v alue s f o r t h e e quatio n a r e f oun d i n t h e m aximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 200 milliwatts. p d = 150 c 25 c 625 c/w = 200 milliwatts the 6 25 c/ w a ssume s t h e u s e o f t h e r ecommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts. another alternative would be to use a ceramic substrate or an aluminum core board such a s t herma l c lad ? . u sin g a b oar d m ateria l s uc h a s thermal clad, a power dissipation of 400 milliwatts can be achieved using the same footprint. soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short t im e c oul d r esul t i n d evic e f ailure . t herefore , t he following i tem s s houl d a lway s b e o bserved i n o rde r t o minimize t h e t herma l s tres s t o w hic h t h e d evice s a re subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference should be a maximum of 10 c. ? the soldering temperature and time should not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient should be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling * soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
3 motorola smallsignal transistors, fets and diodes device data solder stencil guidelines prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. a solder stencil is required to screen the optimum amount of solder paste onto the footprint. the stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. the stencil opening size for the sc59 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. typical solder heating profile for any given circuit board, there will be a group of control settings that will give the desired heat pattern. the operator must s e t t emperature s f o r s evera l h eatin g z ones , a n d a figure for belt speed. t aken together , these control settings make up a heating aprofileo for that particular circuit board. on m achine s c ontrolled b y a c ompute r, t h e c omputer remembers these profiles from one operating session to the next. figure 1 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. this profile will vary among soldering systems but it is a good starting point. factors that can af fect the profile include the type o f s olderin g s yste m i n u se , d ensit y a n d t ype s o f components on the board, type of solder used, and the type of board or substrate material being used. this profile shows temperature versus time. the line on the graph shows the actual temperature that might be experienced on the surface of a t es t b oar d a t o r n ea r a c entra l s olde r j oint . t h e t wo profiles are based on a high density and a low density board. the v itronics smd310 convection/infrared reflow soldering system was used to generate this profile. the type of solder used w a s 6 2/36/ 2 t i n l ea d s ilve r w it h a m eltin g p oint between 177 189 c. when this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, a bsorb s t h e t herma l e nergy m or e e fficiently , t hen distributes this energy to the components. because of this effect, t h e m ai n b od y o f a c omponen t m a y b e u p t o 3 0 degrees cooler than the adjacent solder joints. step 1 preheat zone 1 arampo step 2 vent asoako step 3 heating zones 2 & 5 arampo step 4 heating zones 3 & 6 asoako step 5 heating zones 4 & 7 aspikeo step 6 vent step 7 cooling 200 c 150 c 100 c 50 c time (3 to 7 minutes total) t max solder is liquid for 40 to 80 seconds (depending on mass of assembly) 205 to 219 c peak at solder joint desired curve for low mass assemblies desired curve for high mass assemblies 100 c 150 c 160 c 170 c 140 c figure 1. typical solder heating profile
4 motorola smallsignal transistors, fets and diodes device data package dimensions case 318d03 issue e style 1: pin 1. emitter 2. base 3. collector s g h d c b l a 1 3 2 j k dim a min max min max inches 2.70 3.10 0.1063 0.1220 millimeters b 1.30 1.70 0.0512 0.0669 c 1.00 1.30 0.0394 0.0511 d 0.35 0.50 0.0138 0.0196 g 1.70 2.10 0.0670 0.0826 h 0.013 0.100 0.0005 0.0040 j 0.10 0.26 0.0040 0.0102 k 0.20 0.60 0.0079 0.0236 l 1.25 1.65 0.0493 0.0649 s 2.50 3.00 0.0985 0.1181 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. sc59 motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability , including without limitation consequential or incidental damages. at ypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including at ypicalso must be validated for each customer application by customer ' s technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur . should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. how to reach us: usa / europe / locations not listed : motorola literature distribution; japan : nippon motorola ltd.; tatsumispdjldc, 6f seibubutsuryucenter, p.o. box 20912; phoenix, arizona 85036. 18004412447 or 6023035454 3142 tatsumi kotoku, tokyo 135, japan. 038135218315 mfax : rmf ax0@email.sps.mot.com t ouchtone 6022446609 asia/pacific : motorola semiconductors h.k. ltd.; 8b tai ping industrial park, internet : http://designnet.com 51 ting kok road, tai po, n.t., hong kong. 85226629298 msd601rt1/d
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